Gratis forsendelse intel værdiboks til kernen L3406 2.26 G LGA 1156 30w MB Dual-Core cpu processor

Tags: dual x79, amd ryzen, w cpu, xeon processor, xeon, Lga 1156-bundkort, x3440, sæt core i3, xeon e 5 2650, CPU.

free shipping intel latop core L3406 2.26G LGA 1156 30w MB Dual-Core cpu processor

Intel Xeon L3406 specifications

The specs can be used for short-term

listings on auction and classifieds sites General information Type Market segment Server Family Model number CPU part numbers CM80616005010AA is an OEM/tray microprocessor BX80616L3406 is a boxed microprocessor Frequency 2267 MHz Maximum turbo frequency 2533 MHz Bus speed 2.5 GT/s DMI Clock multiplier 17 Package 1156-land Flip-Chip Land Grid Array (FC-LGA10)

1.48" x 1.48" (3.75 cm x 3.75 cm) Socket Introduction date Price at introduction $189 S-spec numbers Part number ES/QS processors Production processors BX80616L3406 + + CM80616005010AA + + + + Architecture / Microarchitecture Microarchitecture Westmere Platform Foxhollow-WS Processor core Core steppings C2 (SLBQQ)

K0 (Q4DN, SLBT8) CPUID 20652 (SLBQQ) Manufacturing process 0.032 micron

382 million transistors (CPU die)

177 million transistors (IMC / graphics die) Die 81mm 2 (CPU die)

114mm 2 (IMC / graphics die) Data width 64 bit The number of CPU cores 2 The number of threads 4 Floating Point Unit Integrated Level 1 cache size 2 x 32 KB instruction caches

2 x 32 KB data caches Level 2 cache size 2 x 256 KB Level 3 cache size 4 MB shared cache Physical memory 16 GB Multiprocessing Uniprocessor Extensions and Technologies MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 EM64T / Extended Memory 64 technology / Intel 64 NX / XD / Execute disable bit HT / Hyper-Threading technology VT-x / Virtualization technology VT-d / Virtualization for directed I/O TXT / Trusted Execution technology TBT / Turbo Boost technology Low power features Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology Integrated peripherals / components Integrated graphics None Memory controller The number of controllers: 1

Memory channels: 2

Channel width (bits): 64

Supported memory: DDR3-1066

DIMMs per channel: 2

Maximum memory bandwidth (GB/s): 17.1

ECC supported: Yes Other peripherals Direct Media Interface PCI Express 2.0 interface (1 lane) Electrical / Thermal parameters V core 0.65V - 1.4V Maximum operating temperature 53.9°C Thermal Design Power

30 Watt

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